| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board having fine high-density wiring lines excellent in electric insulating property.SOLUTION: The method for manufacturing a wiring board includes the steps of: laminating an ultrathin copper foil 6 having a maximum height Rz of 1.5 to 2 μm on an exposed major surface thereof on a surface of an insulating layer 1; depositing a plating resist layer R on the exposed major surface of the ultrathin copper foil 6 so as to expose the ultrathin copper foil 6 along a pattern shape corresponding to a wiring conductor 2; depositing an electrolytic copper plating layer 9 for forming the wiring conductor 2 on the ultrathin copper foil 6 exposed from the plating resist layer R; peeling and removing the plating resist layer R from above the major surface of the ultrathin copper foil 6; and finally removing the ultrathin copper foil 6 in a part covered with the plating resist layer R by etching, so as to form the wiring conductor 2 comprising the remaining ultrathin copper foil 6 and the electrolytic copper plating layer 9 on the copper foil 6. |
