发明名称 半導体装置用パッケージ、およびその製造方法、並びに半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a package designed such that gap between a mounting base plate and the package is reduced and heat dissipation can be improved.SOLUTION: A package comprises a base plate, a frame part, an input-side cushion plate, an output-side cushion plate, an input lead, an output lead, and a brazing material. The base plate has a first face and a second face. The frame part is provided in the outer circumferential area of the first face, and has an input-side insulation material, an output-side insulation material, an input conductive part, an output conductive part, and a frame-like wall. The input-side cushion plate is provided in an inner area, and has a linear expansion coefficient smaller than that of the base plate. The output-side cushion plate is provided apart from the input-side cushion plate so as to be opposite the output-side insulation material, and has a linear expansion coefficient smaller than that of the base plate. The brazing material joins between the frame part and the first face, between the input lead and input conductive part, between output lead and output conductive part, between input-side cushion plate and first face, and between the output-side cushion plate and first face. The second face is a polished face, and has warpage smaller than that of the first face.
申请公布号 JP5982303(B2) 申请公布日期 2016.08.31
申请号 JP20130044615 申请日期 2013.03.06
申请人 株式会社東芝 发明人 高木 一考;高塚 眞治
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
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