发明名称 Printing Method for Fabrication of Printed Electronics
摘要 This invention relates to fabrication of high quality printed electronics, particularly without the use of conductive inks, on various substrates by printing catalyst based inks followed by electroless deposition of metals. A method comprising substrate surface modification, preparing catalyst based inks, electroless deposition of a thick layer of metal and post-printing treatment is disclosed.
申请公布号 US2016353578(A1) 申请公布日期 2016.12.01
申请号 US201414552479 申请日期 2014.11.24
申请人 Yang Jun 发明人 Yang Jun;Wang Xiaolong;Zhang Tengyuan;Guo Qiuquan
分类号 H05K3/12;H05K3/18 主分类号 H05K3/12
代理机构 代理人
主权项 1. A method of fabricating electronics on substrates by printing catalyst based ink as seeds for electroless deposition, the method comprising: I. Modifying substrates with functional groups, like polyelectrolytes, wherein the polyelectrolytes have quaternary ammonium groups; II. Applying catalyst based ink onto the substrate, e.g., by a printing method; III. Electroless deposition of metals; IV. Post-printing treatment like thermal sintering, inductive sintering or sintering by pulsed light
地址 London CA