发明名称 |
Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
摘要 |
The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.
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申请公布号 |
US2008230515(A1) |
申请公布日期 |
2008.09.25 |
申请号 |
US20080153431 |
申请日期 |
2008.05.19 |
申请人 |
DOWA MINING CO.,LTD |
发明人 |
IYODA KEN;NAMIOKA MAKOTO;OSANAI HIDEYO;SHIMADA SUSUMU |
分类号 |
C23C18/16;C23F1/02;C23C18/31;C23F1/00;H01L21/48;H01L23/14;H01L23/373;H05K3/00;H05K3/06;H05K3/18 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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