DEFECT DETECTION METHOD, DEFECT DETECTION SYSTEM AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a defect detection method and system capable of accurately removing in a short time a chip including a defect such as a microvoid which is formed on a wafer stuck by a direct bonding method or through an adhesive and is difficult and takes time to be found by visual observation, and to provide a method of manufacturing a light emitting device.

SOLUTION: The method for detecting the defect of the wafer for the light emitting element stuck by the direct bonding method or the adhesive includes at least: a step of detecting the defect of the stuck wafer in a wafer stage; a step of marking the defect position of the wafer; a step of dicing the marked wafer and working it into the chip; and a step of mechanically detecting the marked chip.

COPYRIGHT: (C)2009,JPO&INPIT