| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flat antenna and a plasma processing apparatus, which achieve high-quality plasma processing by avoiding desorption of elements from a dielectric plate. <P>SOLUTION: The plasma processing apparatus, in which a substrate is processed with plasma generated by supplying microwaves into a processing container, is provided with a flat antenna. The flat antenna has multiple pairs of slits 210a. Each of the pairs of slits consists of a first slit 212a and a second slit 214a slightly spaced from the first slit. <P>COPYRIGHT: (C)2009,JPO&INPIT |
