发明名称 RADIO FREQUENCY (RF) SERIES ATTENUATOR MODULE FOR BRIDGING TWO RF TRANSMISSION LINES ON ADJACENT CIRCUIT SUBSTRATES
摘要 An attenuator module having an attenuator disposed on a top surface of a substrate, an input terminal at one end of the attenuator and an output terminal at an opposite end of the attenuator. A pair of spaced electrical conductor pads is disposed on a bottom surface of the substrate, a first one of the pads being disposed under the input terminal and a second one of the pads being disposed under the output terminal. A pair of conductive vias passes through the substrate, one conductive via connecting the input terminal to the first one of the pads and the other conductive via connecting the output terminal to the second one of the pads. The module may be used to interconnect two adjacent circuit substrates.
申请公布号 US2016268991(A1) 申请公布日期 2016.09.15
申请号 US201514641939 申请日期 2015.03.09
申请人 Raytheon Company 发明人 Laighton Christopher M.;Borkowski Michael T.;Bielunis Alan J.
分类号 H03H7/24;H05K1/18;H05K1/11;H01P3/08 主分类号 H03H7/24
代理机构 代理人
主权项 1. An attenuator module, comprising: a substrate; an attenuator disposed on a top surface of the substrate, the attenuator having an input terminal at one end of the attenuator and an output terminal at an opposite end of the attenuator; a pair of spaced electrical conductor pads disposed on a bottom surface of the substrate, a first one of the pads being disposed under the input terminal and a second one of the pads being disposed under the output terminal; a pair of conductive vias passing through the substrate, one conductive via connecting the input terminal to the first one of the pads and the other conductive via connecting the output terminal to the second one of the pads.
地址 Waltham MA US