| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor piece which allows for positioning of a cutting member, without detecting a pattern on the substrate surface side by detection means such as a camera.SOLUTION: A method of manufacturing a semiconductor piece includes a step for forming a surface side groove from the surface of a substrate along the cut region of the substrate, and an alignment groove (recess) deeper than the surface side groove, as the alignment mark of a cutting member for cutting from the back side of the substrate along the surface side groove, a step for thinning the substrate from the back side of the substrate so as to reach the alignment groove but not to reach the surface side groove, a step for positioning the cutting member from the back side of the substrate, by using the alignment groove exposed to the surface as a positioning mark, and a step for cutting from the back side of the substrate toward the surface side groove, by means of the cutting member thus positioned.SELECTED DRAWING: Figure 1 |
