| 摘要 |
A photoelectric scanning method and device for detecting the distribution state of a silicon wafer in a semiconductor device loading region. Two photoelectric sensors respectively serving as a transmitting end and a receiving end are disposed at opposite positions of a U-shaped end portion of a manipulator (1) located at the side edge of the circumference of a silicon wafer loader (3); the manipulator (1) provides horizontal and vertical and/or positioned movement for the photoelectric sensors; and the loader (3) and the manipulator (1) can perform relative rotation and/or positioned movement. By means of the strength or width change of feedback value reception time of the two oppositely emitting type photoelectric sensors along with a shielding range, scanning detection is carried out on abnormal distribution states of the silicon wafers, that are, the silicon wafers are protruded, the silicon wafers are laminated, the silicon wafers are inclined or no silicon wafer exists; furthermore, multiple scanning detection points are disposed around the loader (3), thereby further improving the detection precision. Therefore, by means of the method and the device, the silicon wafer distribution state in a silicon wafer semiconductor device loading region can be detected rapidly and accurately and damage to silicon wafers and equipment caused by movement of the manipulator (1) is avoided, and the implementation is simple. |
