MEMORY MODULE TEST SOCKET DEVICE

摘要

A socket device for a memory module test is provided to change a contact structure by a wire bending method to widen a contact area between a memory module and a contact, thereby improving the performance of the memory module test. A socket device for a memory module test includes a body(200), a contact containing groove, an extraction lever(300), a contact(400), and a fixing bracket(500). The body has an insertion slot(202) so as for a contact terminal side(101) of a memory module(100) to be inserted. The contact containing groove forms the plural number of pairs in the lower both sides of the insertion slot. The extraction lever extracts the memory module inserted to the insertion slot. The contact has an elastic wire bending member which is in contact with the memory module in the contact containing groove. The fixing bracket supports the contact. The contact is contained by bending the elastic wire bending member. The contact has elastic force capable of being in contact with the memory module. The fixing bracket is coupled to the lower part of the body.