发明名称 |
COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
A composition for forming a printed circuit board is provided to improve mechanical property and thermal property in use as a material of a substrate, to ensure excellent heat resistance and reduced thermal expansion. A composition for forming a printed circuit board comprises a polyamic acid of chemical formula 1 which is introduced with a cross-linkable group to at least one of both ends of a main chain; a liquid crystalline polymer or a liquid crystal thermoset oligomer; and organic solvent. In chemical formula 1, A is represented by chemical formula 2; if n is 2 or more, A is identical or different; Each Z1 and Z2 may be identical or different and is a monovalent crosslinkable functional group having a carbon-carbon double bond; Y1 is divalent aliphatic or aromatic organic group; and n is an integer of 1-1,000.
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申请公布号 |
KR20090064288(A) |
申请公布日期 |
2009.06.18 |
申请号 |
KR20080089314 |
申请日期 |
2008.09.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG FINE CHEMICALS CO., LTD. |
发明人 |
JUNG, MYUNG SUP;YANG, YOO SEONG;CHO, CHUNG KUN;GU, BON HYEOK;SUH, SANG HYUK |
分类号 |
C08L79/08;C08J3/02;C08K5/00;H05K3/00 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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地址 |
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