发明名称 電子デバイスおよびその製造方法、並びに、電子機器
摘要 PROBLEM TO BE SOLVED: To provide an electronic device which suppresses adhesion of a sealing member to functional elements and can obtain excellent characteristics.SOLUTION: An electronic device 100 related to the present invention includes: a first member 10; a second member 20 which is made of silicone, is mounted on the first member 10 and is provided with a hole portion 40 at one surface 22 side; functional elements 102 accommodated in a cavity 32 surrounded by the first member 10 and the second member 20; and a sealing member 60 disposed in the hole portion 40. The hole portion 40 is provided with a bottom surface 41 and communicates with the cavity 32 via a communication port 70 provided on a part of the bottom surface 41. When an area of an opening 42 of the hole portion 40 at the one surface 22 side is represented as S1, an area of an opening 72 of the communication port 70 at the one surface 22 side is represented as S2, an area of an opening 74 of the communication port 70 at the cavity 32 side is represented as S3 and an area of the bottom surface 41 of the hole portion 40 is represented as S4, S1, S2, S3 and S4 have a relation of S2<S3<S4<S1.
申请公布号 JP5999298(B2) 申请公布日期 2016.09.28
申请号 JP20110244468 申请日期 2011.11.08
申请人 セイコーエプソン株式会社 发明人 瀧澤 照夫
分类号 H01L23/02;G01C19/5747;G01C19/5783 主分类号 H01L23/02
代理机构 代理人
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