| 摘要 |
PROBLEM TO BE SOLVED: To provide: a polishing liquid composition for a silicon wafer, which enables both of the achievement of the reduction in silicon wafer surface roughness (haze) and surface defect (LPD) and the achievement of a high polishing speed even after having gone through a high-temperature long-term storage; and a method for manufacturing a semiconductor substrate and a method for polishing a silicon wafer, which are arranged by use of such a polishing liquid composition.SOLUTION: A polishing liquid composition for a silicon wafer comprises: silica particles (component A); a nitrogen-containing basic compound (component B); and a water-soluble polymer compound (component C) including a constitutional unit I expressed by the general formula (1), and a constitutional unit II expressed by the general formula (2).SELECTED DRAWING: None |
