| 摘要 |
PROBLEM TO BE SOLVED: To extremely reduce the amount of generated heat of a resistor that is radiated into the internal space of an enclosure. SOLUTION: A semiconductor stack is composed by alternately laminating flat power semiconductor devices 10 and 12, and cooling bodies 22-24. A common condenser 25 condenses and liquefies a refrigerant that is vaporized by cooling bodies 22-24. Connection pipes 26-28 guide the refrigerant that is vaporized by the cooling bodies 22-24 to the common condenser 25. Liquid-returning pipes 29-31 allow the refrigerant that is condensed and liquefied by the common condenser 25 to flow back to the cooling bodies 22-24. Resistors 33-35 are provided so that they are in contact with the side surface of the cooling bodies 22-24 for forced cooling, thus extremely reducing the amount of heat that is discharged from the resistors 33-35 to the internal space of the enclosure.
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