| 摘要 |
Provided is a resin sealed semiconductor device with improved reliability. After positioning a cap (lid) so as to cover semiconductor chips and wires, resin is supplied into a space formed by the cap, so that a sealing body is formed to cover the semiconductor chips and the wires. In the step of forming the sealing body, the resin is supplied from an opening formed at a corner of the cap in the planar view. The sealing body is exposed at the corner of the cap, so that the exposed part of the sealing body can be kept away from the wires. |
