| 摘要 |
PURPOSE: A chip mounter head is provided to accurately populate the electronic components on a substrate. CONSTITUTION: A chip mounter includes a component position regulator(82), a component arrangement sensor(6), and a main frame(10) positioned on the component arrangement sensor(6). A hollow shaft motor(14) supported by the main frame(10), and its center line penetrates a penetration hole. A ball spline(26) is fixedly mounted to the hollow shaft(16) of the hollow shaft motor(14). A spindle(24) penetrates the ball spline(26) and the penetration hole(12), includes at least one spindle groove(72) in a direction of a length, so that the spindle(24) receives a rotation power from the motor(14) through the ball spline(26), and performs a shaft rotation and an elevation movement. A bearing(86) is mounted to a part(84) formed along a circumference. Absorption part(18) is mounted to a lower part of the spindle(24). Air flow path(20) is formed to a center shaft part in a length direction. A spindle frame(30) includes the bearing(86), supports the spindle(24) for a rotation, and mounts a rack equipment at its one side so that at least two racks in parallel connected to each other make one pair. A motor(34) drives a pinion(32) meshed with the racks(42,44) of the rack equipment(28), elevates the rack equipment(28), and is mounted to a main frame(10).
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