| 摘要 |
According to one embodiment, a small-size module an IC chip having leads provided on at least two sides of the IC chip, a circuit substrate having a component mounting face, plural pairs of auxiliary substrates which are disposed between the component mounting face of the circuit substrate and the IC chip so as to nip the leads extending from each of the two sides and mount the IC chip on the component mounting face of the circuit substrate, and a through conductor which is provided in at least one of the pair of the auxiliary substrates and bonded conductively to the nipped leads to connect the leads to the circuit substrate.
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