| 摘要 |
PROBLEM TO BE SOLVED: To insulate a substrate from a heat radiation member and concurrently radiate heat of elements mounted on the substrate.SOLUTION: A circuit board includes: a substrate 22 on which a circuit including FETs 41A, 41D and a ground terminal is mounted and a ground area, with which the ground terminal of the mounted circuit is connected, is provided; and a heat sink 21 including projections 27, 28, which are located at one portion at a side fixed to the substrate 22 and contact with the ground area, and fixed to the substrate 22 in a state where areas other than the projections 27, 28 do not contact with the substrate 22.SELECTED DRAWING: Figure 4 |
