| 摘要 |
PURPOSE: A pressure box assembly of plating apparatus is provided to realize miniaturization of the whole lead frame plating apparatus by independently miniaturize a pressure box assembly. CONSTITUTION: A plurality of through holes(41) are formed at the center of a interior jet plate(22). A concave portion(43) with a electrode mounted therein is formed around the through hole. A projection(44) is formed at periphery of both side of the interior jet plate. A mold mask(16) has a structure with a lower surface thereof opened. The projection of the interior jet plate is inserted in a side end of the mold mask. A pattern hole(42) respectively corresponding to through holes of the interior jet plate are formed at a upper surface of the mold mask. An exterior box(21) has a structure with a upper surface thereof opened. A supply pipe(24) is provided so that it can pass through a lower surface of the exterior box. The interior jet plate and the mold mask are formed at periphery of a upper surface of the exterior box. Thereby, the miniaturization of the whole lead frame plating apparatus by independently miniaturize the pressure box assembly can be realized, so that a manufacturing productivity can be improved.
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