Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package

摘要

A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is adhered to the recessed surfaces of the tie bars, connectors which electrically connect a plurality of chip pads formed on an upper surface of the semiconductor chip with the plurality of leads, and an encapsulant which encapsulates the upper surface of the semiconductor chip, the connector and bonding portions of the connector.