| 摘要 |
PROBLEM TO BE SOLVED: To suppress contact of the contact surface, to be connected with a through electrode, with a conductive region other than the through electrode, without requiring any additional cost and without impeding compaction of a chip.SOLUTION: A wiring structure includes a first through hole 102 formed to penetrate a substrate 101, and a counterbore part 103 formed in a first surface 101a of the substrate 101 around the first through hole 102, with an area wider than the first through hole 102. The wiring structure further includes a first insulation layer 104 formed on the inner sidewall of the first through hole 102, and a second insulation layer 105 formed by filling the counterbore part 103 continuously to the first insulation layer 104. A through electrode 107 penetrating the substrate 101 is also provided in a second through hole 106 surrounded by the first insulation layer 104 in the first through hole 102.SELECTED DRAWING: Figure 1 |
