| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic components mounting structure in which mounting density and connection reliability can be improved. SOLUTION: The electronic component mounting structure for mounting an electric component 130 in which the electronic component 130 having a plurality of terminals 132 extending from the body portion thereof 131 is disposed on a substrate 110, with the terminals 132 and a corresponding land 112 provided on the substrate 110 being electrically connected via a solder 113, wherein each terminal is provided with a surface mounting portion 132a that runs along a surface of the substrate 110 where electric components are disposed, and an insertion-mounting portion 132b that projects from the surface mounting portion 132a to the substrate side, serving as a region connecting to the land 112; a non through-hole 111 for allowing the insertion-mounting portion 132b to be inserted is provided on the substrate 110; and the insertion-mounting portion 132b is inserted into the non through-hole 111 for electrically connection to the non through-hole and corresponding land 112 which is provided around the non through-hole of the substrate 110. COPYRIGHT: (C)2007,JPO&INPIT
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