发明名称 METHOD FOR MANUFACTURING OLED DEVICE AND OLED DEVICE MANUFACTURED THEREWITH
摘要 The present invention provides a method for manufacturing an OLED device and an OLED device manufactured therewith. The method for manufacturing an OLED device includes: (1) providing a substrate and forming, in sequence, an anode and a hole transporting layer on the substrate; (2) forming an emissive layer on the hole transporting layer through a solution film casting process, wherein the emissive layer comprises a red sub-pixel, a green sub-pixel, and a blue sub-pixel, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material; (3) forming, in sequence, an electron transporting layer and a cathode on the emissive layer; and (4) providing a package cover plate, which is set above the cathode, wherein the substrate and the package cover plate are bonded together by sealing enclosing resin to complete packaging of the OLED device. Since each sub-pixel of the emissive layer is formed through a solution film casting process, the manufacture of the OLED device requires no use of a fine metal mask so that the manufacturing cost is low, the utilization rate of material is high, and the yield rate is good.
申请公布号 US2016254473(A1) 申请公布日期 2016.09.01
申请号 US201414424001 申请日期 2014.10.31
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 LIU Yawei;WANG Yifan
分类号 H01L51/50;H01L27/32;H01L51/56;H01L51/52;H01L51/00 主分类号 H01L51/50
代理机构 代理人
主权项 1. A method for manufacturing an organic light-emitting diode (OLED) device, comprising: (1) providing a substrate and forming, in sequence, an anode and a hole transporting layer on the substrate; (2) forming an emissive layer on the hole transporting layer through a solution film casting process, wherein the emissive layer comprises a red sub-pixel, a green sub-pixel, and a blue sub-pixel, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material; (3) forming, in sequence, an electron transporting layer and a cathode on the emissive layer; and (4) providing a package cover plate, which is set above the cathode, wherein the substrate and the package cover plate are bonded together by sealing enclosing resin to complete packaging of the OLED device.
地址 Shenzhen, Guangdong CN