发明名称 |
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE |
摘要 |
Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate having a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side thereof; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant molded and installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members. |
申请公布号 |
US2016300988(A1) |
申请公布日期 |
2016.10.13 |
申请号 |
US201415038042 |
申请日期 |
2014.11.20 |
申请人 |
LUMENS CO., LTD. |
发明人 |
OH Seung-Hyun;JO Sung-Sik;LIM Jung-A;YUN Sung-Yole;LEE Ji-Yeon;KIM Bo-Young |
分类号 |
H01L33/62;H01L33/56;H01L33/60;H01L33/50 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
1. A light emitting device package comprising:
a light emitting device including a first terminal and a second; a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separating space; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant installed on the substrate so as to form a reflection cup part configured to reflect light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members. |
地址 |
Yongin-si KR |