METHOD FOR MACHINING SILICON SUBSTRATE, AND LIQUID EJECTION HEAD

摘要

A method for machining a silicon substrate through which a through-hole is created in the silicon substrate and a structure of a liquid ejection head using this method, wherein first recesses are machined in a first surface of a silicon substrate, and a sidewall-protecting film is formed on the side walls of the first recesses. The bottom section of the first recesses is then etched. After that, cavities are created that have a larger cross-sectional area than the first recesses in the horizontal direction of the substrate, and an etching stopper film is formed on the inner walls of the cavities. A second recess is then machined from a second surface of the silicon substrate to make at least part of the etching stopper film exposed. Lastly, the etching stopper film is removed to make the first recesses communicate with the second recess, completing a through-hole.

主权项

1. A method for machining a silicon substrate by creating a hole section through the silicon substrate from a first surface to an opposite second surface of the substrate, the method comprising:
(A) machining a first recess in the first surface of the silicon substrate; (B) forming a sidewall-protecting film on a side wall of the first recess; (C) etching a bottom section of the first recess to create a cavity, the cavity having a larger spatial-cross-sectional-area section than the first recess in a horizontal direction of the substrate; (D) forming an etching stopper film on at least an inner wall of the cavity extending in the horizontal direction of the substrate; (E) machining a second recess from the second surface of the silicon substrate; (F) making the etching stopper film exposed in at least part of the second recess; and (G) removing at least part of the exposed etching stopper film to make the first recess communicate with the second recess.