发明名称 |
MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION |
摘要 |
A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes:
a) no more than 5.0 wt % of a thermoplastic polymer;b) no more than 5.0 wt % of nano-sized core-shell particles;c) no more than 5.0 wt % of nano-sized inorganic particles;d) an epoxy resin component; ande) one or more amine curing agent(s),
wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130′ C. |
申请公布号 |
US2016176083(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
US201514970159 |
申请日期 |
2015.12.15 |
申请人 |
Cytec Industries Inc. |
发明人 |
MEEGAN Jonathan E.;DENMAN Olivia;AURILIA Marco |
分类号 |
B29C45/00;B29C35/02;B29C45/72;C08L63/00;B29C45/14 |
主分类号 |
B29C45/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A liquid resin infusion (LRI) manufacturing process for producing a molded article, comprising the steps of providing a curable composition, injecting said curable composition into a mold, and curing said curable composition, wherein the curable composition comprises:
a) no more than 5.0 wt % of a thermoplastic polymer: b) no more than 5.0 wt % of core-shell particles wherein said core-shell particles have a particle size in the range of from about 50 nm to about 800 nm: c) no more than 5.0 wt % of inorganic particles wherein said inorganic partides have a particle size in the range of from about 2.0 nm to about 800 nm; d) an epoxy resin component which comprises one or more epoxy resin precursor(s): and e) one or more amine curing agent(s),wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130° C. |
地址 |
Woodland Park NJ US |