发明名称 MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION
摘要 A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer;b) no more than 5.0 wt % of nano-sized core-shell particles;c) no more than 5.0 wt % of nano-sized inorganic particles;d) an epoxy resin component; ande) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130′ C.
申请公布号 US2016176083(A1) 申请公布日期 2016.06.23
申请号 US201514970159 申请日期 2015.12.15
申请人 Cytec Industries Inc. 发明人 MEEGAN Jonathan E.;DENMAN Olivia;AURILIA Marco
分类号 B29C45/00;B29C35/02;B29C45/72;C08L63/00;B29C45/14 主分类号 B29C45/00
代理机构 代理人
主权项 1. A liquid resin infusion (LRI) manufacturing process for producing a molded article, comprising the steps of providing a curable composition, injecting said curable composition into a mold, and curing said curable composition, wherein the curable composition comprises: a) no more than 5.0 wt % of a thermoplastic polymer: b) no more than 5.0 wt % of core-shell particles wherein said core-shell particles have a particle size in the range of from about 50 nm to about 800 nm: c) no more than 5.0 wt % of inorganic particles wherein said inorganic partides have a particle size in the range of from about 2.0 nm to about 800 nm; d) an epoxy resin component which comprises one or more epoxy resin precursor(s): and e) one or more amine curing agent(s),wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80′ C. to about 130° C.
地址 Woodland Park NJ US