发明名称 PASSIVATION FOR SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a passivation layer for a semiconductor light emitting device.SOLUTION: A passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. Material configured as adhesion to an underfill is disposed over an etched surface of the semiconductor structure.SELECTED DRAWING: Figure 1
申请公布号 JP2016174179(A) 申请公布日期 2016.09.29
申请号 JP20160110800 申请日期 2016.06.02
申请人 KONINKLIJKE PHILIPS NV;PHILIPS LUMILEDS LIGHTNG CO LLC 发明人 FREDERIC S DIANA;HENRY KWONG-HIN CHOY;MO QINGWEI;SERGE L RUDAZ;FRANK L WEI;DANIEL A STEIGERWALD
分类号 H01L33/48;H01L33/44;H01L33/60 主分类号 H01L33/48
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