发明名称 |
A process for manufacturing encapsulated optical sensors, and an encapsulated optical sensor manufactured using this process |
摘要 |
A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors (24) in a wafer (10) of semiconductor material; bonding a plate (30) of transparent material to the wafer (10) so as to seal the optical sensors (24); and dividing the wafer (10) into a plurality of dice (40), each comprising an optical sensor (24) and a respective portion (41) of the plate (30). <IMAGE> |
申请公布号 |
EP1369929(B1) |
申请公布日期 |
2016.08.03 |
申请号 |
EP20020425334 |
申请日期 |
2002.05.27 |
申请人 |
STMICROELECTRONICS SRL |
发明人 |
COGNETTI, CARLO;MASTROMATTEO, UBALDO |
分类号 |
G01J1/02;H01L31/0203;H01L27/14;H01L31/0232;H01L31/18 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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