| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck that can be manufactured by a simple manufacturing process, and is highly reliable in electrical insulation between an electrode and a metal plate and between electrodes, and especially to provide an electrostatic chuck having a high wafer cooling capacity. SOLUTION: The metal plate 21 in which an insulator film 22 is formed on the surface by flame spraying, and a dielectric substrate 24 in which the electrode 25 is formed on the surface, are joined by interposing an insulating adhesive 23 so that the electrode 25 is disposed opposite thereto. The thickness of the insulator film 22 is 0.3 mm or higher and 0.6 mm or smaller. The thermal conductivity of the insulating adhesive 23 is 1 W/mK or higher, and that of the insulator film 22 is larger than that of the insulating adhesive 23. COPYRIGHT: (C)2007,JPO&INPIT |
