Multi-chip semiconductor power device

摘要

A semiconductor device includes a first semiconductor power chip mounted over a first carrier and a second semiconductor power chip mounted over a second carrier. The semiconductor device further includes a contact clip mounted over the first semiconductor power chip and on the second semiconductor power chip. A semiconductor logic chip is mounted over the contact clip.

主权项

1. A semiconductor device, comprising:
a first semiconductor power transistor chip having a first electrode on a first surface and a second electrode on an opposite second surface, the first semiconductor power transistor chip being mounted over a first carrier such that the second surface of the first semiconductor power transistor chip faces the first carrier and the second electrode is coupled to the first carrier; a second semiconductor power transistor chip having a first electrode on a first surface and a second electrode on an opposite second surface, the second semiconductor power transistor chip being mounted over a second carrier such that the second surface of the second semiconductor power transistor chip faces the second carrier and the second electrode is coupled to the second carrier; a contact clip mounted over the first semiconductor power transistor chip and over the second semiconductor power transistor chip such that the first surfaces of the first and second semiconductor power transistor chips face the contact clip and the first electrodes of the first and second semiconductor power transistor chips are coupled to the contact clip; and a semiconductor logic chip mounted over the contact clip, wherein the first and second semiconductor power transistor chips are arranged side by side in a first plane, the semiconductor logic chip is arranged in a second plane above the first plane, and the contact clip is arranged between the first and second planes.