| 摘要 |
A chip package structure including a chip, a leadframe, multiple bonding wires and an encapsulant is provided. The chip has an active surface and multiple contacts. The contacts are located on one side of the active surface. The chip is fixed under the leadframe. The leadframe has multiple first inner leads located on the active surface, and multiple second leads, wherein one end of each first inner lead and one end of each second inner lead are at near outside of one of the contacts. The bonding wires respectively connect the first inner leads and the second inner leads to the contacts. The encapsulant wraps the chip, the first inner leads, the second inner leads and the bonding wires. Because the contacts are located on one side of the active surface, the possibility of collapse of the bonding wires is reduced.
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