发明名称 METHOD FOR EVALUATING ABRASIVE GRAINS, AND METHOD FOR MANUFACTURING SILICON WAFER
摘要 A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to dissolve in a solvent to prepare an evaluation solution, a settling step (S3) in which a vessel containing the evaluation solution is left to stand and the polishing abrasive grains are allowed to settle, a measurement step (S5) for measuring the turbidity of the supernatant of the evaluation solution using a measuring device, and an estimation step (S6) for estimating the impurity content on the basis of the results obtained from measuring the turbidity of the supernatant.
申请公布号 WO2016103854(A1) 申请公布日期 2016.06.30
申请号 WO2015JP78852 申请日期 2015.10.09
申请人 SUMCO CORPORATION 发明人 MINAMIHATA YUUJI
分类号 B24B27/06;B24B57/02;G01N15/06;G01N21/49;G01N33/40;H01L21/304 主分类号 B24B27/06
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