发明名称 THIN-FILM FORMING METHOD, THIN-FILM DEVICE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of carrying out a good film forming independently of a relationship of properties of the film forming surface and properties of a liquid material when carrying out film forming using a liquid process. SOLUTION: The thin-film forming method is carried out by using the liquid material containing a solute to be changed to a thin film and a solvent for dissolving or dispersing it, wherein the method consists of the first step for lowering a temperature at least near the film forming surface of an objective material (10) to the solidifying temperature of the liquid material or below, the second step for dropping the liquid material (12) on the film forming surface of the objective material, the third step for making the liquid material solidify at the time that the liquid material reaches on the film forming surface of the objective material, and the fourth step for removing the solvent (16) from the solidified liquid material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006150224(A) 申请公布日期 2006.06.15
申请号 JP20040344327 申请日期 2004.11.29
申请人 SEIKO EPSON CORP 发明人 MAKIURA RIE;GOHARA MASAYOSHI
分类号 B05D3/00;B05D3/12;H01L51/50;H05B33/10 主分类号 B05D3/00
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