| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a semiconductor device allowing processes from manufacturing to mounting to be efficiently carried out; their manufacturing methods and mounting methods; a circuit board; and an electronic apparatus. <P>SOLUTION: This semiconductor device has a package size close to its chip size, has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. This manufacturing method of the semiconductor device includes steps of: forming electrodes 12 on a wafer 10; providing a resin layer 14 as a stress relieving layer on the wafer 10, avoiding the electrodes 12; forming a chromium layer 16 as wiring from the electrodes 12 over the resin layer 14; forming solder balls as external electrodes on the chromium layer 16 over the resin layer 14; and cutting the wafer 10 into individual semiconductor chips. In the steps of forming the chromium layer 16 and solder balls, a metal thin film formation technique is used during the wafer process. <P>COPYRIGHT: (C)2009,JPO&INPIT |
