发明名称 基板処理装置および基板処理方法
摘要 PROBLEM TO BE SOLVED: To enhance the temperature conditioning performance of temperature conditioning liquid when a substrate is processed by supplying process liquid to a first surface of the substrate while supplying temperature conditioning liquid to a second surface of the substrate.SOLUTION: A substrate processing device includes: a substrate holding part (10); a process liquid nozzle (44) which supplies process liquid to a first surface of a substrate (W) having a pattern formed thereon; and a temperature conditioning liquid nozzle (54A) which supplies a mixed liquid obtained by mixing pure water with an organic solvent which is miscible with the pure water and whose surface tension is lower than the pure water to a second surface on the side opposite to the first surface of the substrate as a temperature conditioning liquid.
申请公布号 JP5955766(B2) 申请公布日期 2016.07.20
申请号 JP20120288326 申请日期 2012.12.28
申请人 東京エレクトロン株式会社 发明人 戸 島 孝 之
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址