| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact structure and method of burn-in testing after packaging. SOLUTION: The contact structure comprises a printed circuit board, a solder join fixed on the printed circuit board, and a fixed plate. The solder join is fixed on the printed circuit board, and includes a plurality of contact metal springs connected to contact metal balls. The fixed plate is positioned between the solder joins. The fixed plate is formed of a plurality of plates, and a bore diameter of a hole of a lowest plate is minimum, and a bore diameter of a hole of an uppermost plate is maximum. A substantially constant pressure is maintained between the contact metal balls and metal springs when a surface of the fixed plate, which is in contact with a surface of a wafer level package, is used. COPYRIGHT: (C)2008,JPO&INPIT
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