| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition of excellent moldability for sealing a semiconductor preventing effectively moisture from intruding from outside, and the semiconductor using the same. <P>SOLUTION: This resin composition for sealing the semiconductor contains a resin and a spherical particulate filler with a plurality of pores formed on its surface, an average particle size of the plurality of pores of the filler is smaller than that of a resin molecule before cured, and an alkaline earth metal is added to the surface containing the pores of the filler. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
