SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image sensor chip, and the holder has an inner surface facing the image sensor chip and an outer surface opposite to the inner surface. The semiconductor package further includes a transparent cover combined with the holder, and the transparent cover is spaced apart from and faces the substrate. The holder includes: a hole penetrating the holder from the inner surface to the outer surface. In addition, the semiconductor package further includes a first stopper disposed in the hole and a second stopper disposed at a position corresponding to the hole on the outer surface of the holder.

主权项

1. A semiconductor package comprising:
an image sensor device comprising: a substrate, an image sensor chip mounted on the substrate, an adhesive layer disposed between the substrate and the image sensor chip and configured to bond the image sensor chip and the substrate to each other, a holder disposed on the substrate and surrounding the image sensor chip, the holder having an inner surface facing the image sensor chip and an outer surface opposite to the inner surface, and wherein the holder includes a hole penetrating the holder from the inner surface to the outer surface, a transparent cover combined with the holder, the transparent cover spaced apart from and facing the substrate, wherein there is a space between the image sensor chip and the transparent cover, and an adhesive stopper disposed on the outer surface of the holder and sealing the hole closed; a package substrate disposed facing the image sensor device; and a plurality of bumps including a conductive material disposed between the image sensor device and the package substrate, wherein the image sensor device is electrically connected to the package substrate through the bumps.