| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of having a semiconductor element made compact and efficiency in designing while maintaining the performance of the semiconductor element, and a substrate. <P>SOLUTION: While the semiconductor element 12 is provided with a ground terminal electrode 52a and a power supply terminal electrode 52b nearby semiconductor element internal output portions 30A to 30D outputting a signal driving a display device, an insulating film 18 is provided with a ground terminal 14a and a power supply terminal electrode 14b provided more along one side of the semiconductor element 12 than before, and a metal wiring pattern 54 on the semiconductor element which connects the ground terminal electrode 52a and power supply terminal electrode 52b to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
