发明名称 INTEGRATED CIRCUIT WITH INTRA-CHIP AND EXTRA-CHIP RF COMMUNICATION
摘要 An integrated circuit includes a first integrated circuit die having a first circuit and a first intra-chip interface and a second integrated circuit die having a second circuit and a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device. In an embodiment of the present invention, a shielding element shields the electromagnetic communications with the remote device from the electromagnetic communication of the first signals. In other embodiments, antenna beam patterns or differing polarizations are used to isolate the electromagnetic communications with the remote device from the electromagnetic communication of the first signals.
申请公布号 US2009008753(A1) 申请公布日期 2009.01.08
申请号 US20080210415 申请日期 2008.09.15
申请人 BROADCOM CORPORATION 发明人 ROFOUGARAN AHMADREZA (REZA)
分类号 H01L23/552 主分类号 H01L23/552
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