发明名称 |
SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING |
摘要 |
A layer of amorphous silicon is formed on a germanium-on-insulator substrate, or a layer of germanium is formed on a silicon-on-insulator substrate. An anneal is then performed which causes thermal mixing of silicon and germanium atoms within one of the aforementioned structures and subsequent formation of a silicon germanium-on-insulator material. |
申请公布号 |
US2016359023(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
US201615237260 |
申请日期 |
2016.08.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Bedell Stephen W.;De Souza Joel P.;Kim Jeehwan;Sadana Devendra K. |
分类号 |
H01L29/66;H01L21/288;H01L21/02;H01L21/24;H01L29/10;H01L29/78 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor structure, said method comprising:
forming an amorphous silicon layer portion on a surface of an active silicon germanium region of a silicon germanium-on-insulator material; forming a gate structure on a surface of said amorphous silicon layer portion; and forming an embedded SiGe channel region in said active SiGe region and directly beneath said gate structure utilizing a thermal mixing process in which silicon atoms from said amorphous silicon layer portion intermix with germanium atoms in said SiGe active region to form said embedded SiGe channel region. |
地址 |
Armonk NY US |