发明名称 SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING
摘要 A layer of amorphous silicon is formed on a germanium-on-insulator substrate, or a layer of germanium is formed on a silicon-on-insulator substrate. An anneal is then performed which causes thermal mixing of silicon and germanium atoms within one of the aforementioned structures and subsequent formation of a silicon germanium-on-insulator material.
申请公布号 US2016359023(A1) 申请公布日期 2016.12.08
申请号 US201615237260 申请日期 2016.08.15
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Bedell Stephen W.;De Souza Joel P.;Kim Jeehwan;Sadana Devendra K.
分类号 H01L29/66;H01L21/288;H01L21/02;H01L21/24;H01L29/10;H01L29/78 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of forming a semiconductor structure, said method comprising: forming an amorphous silicon layer portion on a surface of an active silicon germanium region of a silicon germanium-on-insulator material; forming a gate structure on a surface of said amorphous silicon layer portion; and forming an embedded SiGe channel region in said active SiGe region and directly beneath said gate structure utilizing a thermal mixing process in which silicon atoms from said amorphous silicon layer portion intermix with germanium atoms in said SiGe active region to form said embedded SiGe channel region.
地址 Armonk NY US
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