| 摘要 |
An exposure apparatus has a projection optical system configured to project light from a reticle onto a wafer and exposes the wafer to the light in a state where a gap between the projection optical system and the wafer is filled with liquid. In the exposure apparatus, a chuck for holding the wafer has a contact portion that is contactable with the wafer. At least this contact portion of the chuck has a hydrophilic surface having a contact angle of 90° or less with respect to the liquid.
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