发明名称 |
SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD |
摘要 |
Provided is a solder resist composition comprising (A) a carboxyl-group containing resin, (B) an epoxy compound, (C) titanium oxide, (D) a photopolymerization initiator, and (E) an antioxidant. The (B) component contains a hydroquinone-type epoxy compound represented by formula (1). The (D) component contains (D1) a bisacylphosphine oxide photopolymerization initiator and (D2) an α-hydroxyalkylphenone photopolymerization initiator. |
申请公布号 |
WO2016092717(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
WO2015JP04079 |
申请日期 |
2015.08.17 |
申请人 |
GOO CHEMICAL CO., LTD. |
发明人 |
SAKAI, YOSHIO;HIGUCHI, MICHIYA |
分类号 |
G03F7/004;G03F7/029;G03F7/031 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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