A thermally conductive gap filling material for the absorption of electromagnetic (EM) radiation emitted from an electronic device is provided. The gap filling material facilitates conduction of excessive heat generated by the electronic device to a heat dissipater. The heat dissipater further dissipates the excessive heat to the surrounding environment. The gap filling material comprises a binder material and magnetic filler. The magnetic filler is dispersed in binder material. The magnetic filler absorbs EM radiation and causes the gap filling material to be thermally conductive.
申请公布号
WO2008008939(A3)
申请公布日期
2008.02.28
申请号
WO2007US73437
申请日期
2007.07.13
申请人
PARKER HANNIFIN CORPORATION;FOSTER, ROBERT, H.;BUNYAN, MICHAEL, H.