Semiconductor light emitting device and method of manufacturing the same

摘要

A semiconductor light emitting device and method of manufacturing the semiconductor light emitting device are provided. The semiconductor light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The device may also includes a first electrode connected to the first conductivity type semiconductor layer, and a second electrode connected to the second conductivity type semiconductor layer and having a pad region and a finger region extended from the pad region in one direction. The second electrode may include a transparent electrode part positioned on the second conductivity type semiconductor layer and including at least one opening therein, at least one reflective part spaced apart from the transparent electrode part within the opening and disposed in the pad region and the finger region, and a bonding part positioned on at least one portion of the reflective part and including a plurality of bonding finger parts spaced apart from each other in the finger region and a bonding pad part disposed in the pad region.

主权项

1. A semiconductor light emitting device comprising:
a light emitting structure comprising a first conductivity type semiconductor layer, an active layer disposed on the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer disposed on the active layer; a first electrode disposed on the first conductivity type semiconductor layer; and a second electrode having a pad region and a finger region extending from the pad region, wherein the second electrode comprises:
a transparent electrode part disposed on the second conductivity type semiconductor layer and having an opening provided in the pad region and the finger region;a reflective part disposed on the second conductivity type semiconductor layer in the opening of the transparent electrode part in the pad region and the finger region, and spaced apart from the transparent electrode part within the opening; anda bonding part comprising a plurality of bonding finger parts disposed on the reflective part in the finger region and spaced apart from each other, and a bonding pad part disposed on the reflective part in the pad region,wherein the bonding pad part covers the opening of the transparent electrode part in the pad region and extends onto the transparent electrode part, and the bonding pad part is interposed between the transparent electrode part and the reflective part within the opening of the transparent electrode part in the pad region.