MEASUREMENT DEVICE FOR DETERMINING OVEN HEATING PARAMETERS

摘要

A measurement device for determining heating parameters of an oven may generally include a support plate and at least one sensor cup coupled to the support plate. The sensor cup may define a liquid well for receiving a volume of liquid and may include a bottom wall defining a floor of the liquid well. In addition, the measurement device may include a temperature sensor positioned adjacent to the floor of the liquid well such that the temperature sensor is configured to be in fluid contact with at least a portion of the volume of the liquid received within the liquid well. The temperature sensor may be configured to monitor a temperature of the liquid as the liquid is heated and evaporates from the sensor cup.

主权项

1. A system for determining oven heating parameters, the system comprising:
an oven, the oven defining an oven floor; a measurement device configured to be positioned within the oven, the measurement device comprising:
a support plate, the support plate defining a lower surface facing the oven floor and an upper surface opposite the lower surface;an upper sensor cup coupled to the support plate, the upper sensor cup defining an upper liquid well for receiving a first volume of liquid, the upper sensor cup including a bottom wall defining a floor of the upper liquid well, the upper sensor cup being positioned relative to the support plate such that at least a portion of the bottom wall of the upper sensor cup is positioned above the upper surface of the support plate;a lower sensor cup coupled to the support plate, the lower sensor cup defining a lower liquid well for receiving a second volume of liquid, the lower sensor cup including a bottom wall defining a floor of the lower liquid well, the lower sensor cup being positioned relative to the support plate such that at least a portion of the bottom wall of the lower sensor cup is positioned below the lower surface of the support plate;a first temperature sensor positioned adjacent to the floor of the upper liquid well such that the first temperature sensor is configured to be in fluid contact with at least a portion of the first volume of liquid received within the upper liquid well, the first temperature sensor being configured to monitor a temperature of the liquid contained within the upper liquid well as the liquid is heated and evaporates from the upper sensor cup due to heat transferred from the oven; anda second temperature sensor positioned adjacent to the floor of the lower liquid well such that the second temperature sensor is configured to be in fluid contact with at least a portion of the second volume of liquid received within the lower liquid well, the second temperature sensor being configured to monitor a temperature of the liquid contained within the lower liquid well as the liquid is heated and evaporates from the lower sensor cup due to heat transferred from the oven.