| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing a semiconductor element which reduces the possibility that the package is broken by heat, and to provide a semiconductor device.SOLUTION: A package 3 for housing a semiconductor element includes: a rectangular ceramic substrate 5 having a mounting region R of a semiconductor element 2 on its upper surface; a frame body 6 which is provided on the ceramic substrate 5 and encloses the mounting region R; lead terminals 7 which are provided on a lower surface of the ceramic substrate 5 and are electrically connected with the semiconductor element 2; and a metal plate 8 which is provided on the lower surface of the ceramic substrate 5, extends from a region overlapping with the lower surface of the ceramic substrate 5 to a region that does not overlap with the ceramic substrate 5, and is cut out so as to expose four corners of the ceramic substrate 5 and the lead terminals 7. |
