Apparatus and Techniques for Electronic Device Encapsulation

摘要

Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.

主权项

1. A method for providing a substrate coating, comprising:
transferring a substrate to an enclosed ink jet printing system, wherein the enclosed ink jet printing system is configured to deposit a patterned organic material in a deposition region over at least a portion of an active region of a light-emitting device fabricated upon the substrate; printing organic material over the deposition region of the substrate using the enclosed printing system; transferring the substrate with the patterned organic material deposited thereon to an enclosed curing module, wherein the enclosed curing module is configured to treat the organic material deposited on the substrate to form a solid organic film layer; supporting the substrate in the enclosed curing module using a pressurized gas cushion distributed between the substrate and a substrate support apparatus; and treating the organic material deposited on the substrate using the enclosed curing module to form a solid organic film layer.