| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire having fine stitch joining properties in bonding to a resin substrate, and to provide a semiconductor device joined using the bonding wire. <P>SOLUTION: Fine stripe-shaped irregular groove patterns are formed on the surface of a wire having a circular section to extend along the longitudinal direction of the wire. The stripe-shaped patterns are so formed that ovality (percentage given by dividing a difference between the longest wire diameter and the shortest wire diameter among several measurements of the wire diameter by an average wire diameter) is 0.1 to 6%, and that the specific surface area of the wire measured by the BET method is 3 to 100% larger than that of the wire having no stripe-shaped groove patterns formed thereon. <P>COPYRIGHT: (C)2009,JPO&INPIT |
