摘要 |
PROBLEM TO BE SOLVED: To provide a cushioning member that protects semiconductor wafers against external impact when a cassette case is accommodated and packed in a corrugated board box. SOLUTION: When the wafer cassette case is accommodated in a corrugated board box, the cushioning members are interposed between the inner walls of the corrugated board box and the cassette case. The cushioning member is floated such that its upper and lower member sandwich the cassette case from above and below. The upper member and lower member are composed of rectangular frame bodies that surround the lid and bottom of the cassette case respectively and fix them in position. Within the diameter of the semiconductor wafers W in the cassette case when the principal faces of the wafers W are viewed from the front, a plurality of shock absorbing blocks are arranged so as to project toward the inner walls of the corrugated board box. COPYRIGHT: (C)2008,JPO&INPIT
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